Material
FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers
Number of layers
1-28 layers
Out layer Cu thickness
1-6OZ
Inner layer Cu thickness
1-4OZ
Maximum processing area
610*1100mm
Minimum board thickness
2 layers 0.3mm (12mil)
4 layers 0.4mm (16mil)
6 layers 0.8mm (32mil)
8 layers 1.0mm (40mil)
10 layers 1.1mm (44mil)
12 layers 1.3mm (52mil)
14 layers 1.5mm (59mil)
16 layers 1.6mm (63mil)
Minimum Width
0.076mm (3mil)
Minimum Space
0.076mm (3mil)
Minimum hole size (final hole)
0.2mm
Drilling hole size
0.2-0.65mm
Drilling tolerance
+\-0.05mm(2mil)
PTH tolerance
Φ0.2-1.6mm +\-0.075mm (3mil)
Φ1.6-6.3mm+\-0.1mm(4mil)
NPTH tolerance:
Φ0.2-1.6mm +\-0.05mm(2mil)
Φ1.6-6.3mm+\-0.05mm(2mil)
Finish board tolerance
Thickness＜0.8mm, Tolerance:+/-0.08mm
0.8mm≤Thickness≤6.5mm,Tolerance+/-10%
Minimum soldermask bridge
0.076mm (3mil)
Twisting and bending
≤0.75% Min0.5%
Impedance tolerance
+/-10%，Min+/-5%
Surface Treatment
HASL, LF HASL
Immersion Gold, Flash Gold,Gold finger
Immersion Silver, Immersion Tin,OSP
